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PCA

Printed Circuit Board Assembly (PCA)

A high-yielding PCA process eliminates latent manufacturing-induced defects that can result in field failures and reliability issues. Paramit’s printed circuit board assembly (PCA) processes are based on a zero-defect culture, using systems designed to provide a no-defect yield — beginning with the very first board. We use industry-leading verification equipment to control critical processes and ensure defects don’t travel down the line.

PCA Process Validation

Paramit performs process validation on every PCA we build, whether it’s a standalone product or part of a complex system we build in-house. We thoroughly document the validation process and maintain records that are available to both the client and the FDA, should a field failure trigger an audit.

Best-in-Class PCAs

Our rigorous methods and top-notch technical staff all contribute to Paramit’s best-in-class PCA operation which comes in at less than 10 defects per million opportunities (DPMO).

  • New Product Introduction (NPI). Our NPI process includes a Design for Manufacturability (DFM) review to ensure PCAs are designed for optimum yield before they move into the production environment.
  • Stop-on-defect policy and closed-loop work cells. These strategies prevent products with failures from moving down the line until the cause of the defect is resolved.
  • Inline inspection. We inspect 100% of the PCAs we build for solder deposition with a 3D volumetric solder paste system and a post-reflow automated optical inspection. During NPI, we also perform a Design of Experiment (DOE) to design the optimum stencil for screen printing and to determine the solder-paste screen printer settings for ideal solder deposition.
  • Offline inspection. We verify100% of the PCAs we build for BGA (ball grid array) solder joints using an automatic x-ray (5DX) inspection system. This inspection lets us evaluate the integrity of any hidden solder joints, increasing the opportunities for long term reliability.
  • In-Circuit Testing (ICT). ICT verifies the electrical integrity of every PCA using high-end, custom solutions developed by our highly experienced Test Engineering group.
  • Functional test. All our manufacturing engineers have product development backgrounds, allowing them to work through very complex issues in test development, troubleshooting, and root cause analysis.

Questions to Ask Before Hiring a PCA Contract Manufacturer

Paramit’s developed very effective methodologies and techniques for reducing defects during the PCA build process. Based on our experience, we’ve generated a list of Top Ten Questions to Ask Your PCA Contract Manufacturer that reveal a CM’s ability to reliably and consistently produce PCAs that meet specifications and function properly at functional test and in the field. We encourage you to discuss these questions with us and any other contract manufacturers you’re evaluating.

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