Paramit is committed to providing manufacturing technology solutions that meet today’s technology challenges. One of the ways we achieve this is through a strategic partnership with Siemens Dematic. Siemens has invested in a state-of-the-art, Advanced Assembly Technology (AAT) R&D center, which specializes in electronic assembly and test, reliability testing and qualification, materials characterization and analysis, and failure analysis.

With this partnership, Paramit is able to support the following technologies:

• Flip Chip
• 0201 through 55mm BGA processing
• Lead Free Solder
• Fiber Splicing
• Opto-Electronics Assembly
• Wire Bonding
• Specialized Materials Selection and Qualification

In addition, we also support comprehensive failure analysis on the following:

• Printed Circuit Assemblies
• Passive Electronic Components
• Active Electronic Components
• BGA and Micro-BGA’s
• Connectors
• Materials Analysis