Surface Mount
Paramit has purchased best in class SMT assembly equipment designed for speed, accuracy and flexibility. Our facility layout and modular equipment design allows for easy expansion of capacity without sacrificing flexibility. SMT set-up is handled offline supporting chip-to-chip changeover times of less than 10 minutes. Tooling and processes are designed to handle a wide variety of assembly needs; from simple SMT assemblies to highly integrated combinations of SMT, flex circuits and BGA’s. Siemen’s SMT Pick and Place accuracy combined with a Fein Focus X-Ray inspection and in-line Agilent Automated Optical Inspection equipment. BGA rework stations support quality assembly and rework of BGA’s, micro-BGA’s and flip chips.
Thru-Hole
Fully automated Dynapert auto-insertion machines facilitate volume through-hole assembly. Hepco forming machines and manual loading lines provide the flexibility to handle combined SMT and through-hole assemblies. Thru-hole soldering is performed by Soltec and Electrovert dual wave solder machines, capable of handling up to 24" wide boards.